In The News

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  • Delving deep into Micron and Intel’s 20-nm 64-Gbit MLC NAND flash memory
    Monday, March 26, 2012

    The success of NAND flash memory in the semiconductor market is mainly driven by continuous and tremendous growth in the mobile phone and tablet PC markets, and the growth of adoption of high performance solid state drives (SSDs) as a replacement for hard drives in computers.

     

    Munro & Associates, UBM TechInsights and EE Times to Share Advanced Analysis of Key Chevrolet Volt Components at Design West's Embedded Systems Conference
    Tuesday, March 6, 2012

    Key components of the Chevrolet Volt will get an advanced analysis when Al Steier, design prophet, Munro & Associates, Inc., John Scott-Thomas, senior engineer, UBM TechInsights and Brian Fuller, editorial director, EE Times, share their teardown insights of the battery pack, charging and infotainment systems during three separate sessions at Design West's Embedded Systems Conference (ESC) at the San Jose McEnery Convention Center (Design West Theater) in California.

     

    The growth of an intellectual ecosystem
    Thursday, March 1, 2012

    The $4.5-billion sale of Nortel's patent portfolio - far surpassing the combined sale price of its business divisions - to a consortium that included BlackBerry maker Research In Motion.

     

    What'll Be Inside iPhone 5?
    Thursday, July 7, 2011

    It was Apple Inc.'s components suppliers that were responsible for leaking confirmation of a September debut for the thinner, lighter iPhone 5 (or 4S). But what will those components be, and which companies will make their way into the guts of the handset?

     

    Playbook teardown calls TI a winner
    tuesday, april 19, 2011

    Texas Instruments was one of the big winners in the Research in Motion Playbook, according to a teardown conducted by UBM TechInsights. TI won sockets for its Omap 4430 processor, a four-in-one combo connectivity chip and power management and converter chips in the new mobile system.

     

    Teardown slideshow: Inside the Nintendo 3DS
    tuesday, march 29, 2011

    UBM TechInsights said earlier this week revealed that it found within the 3DS two Fujitsu Semiconductor Ltd. fast-cycle RAM (FCRAM) memories. It was the first time UBM TechInsights found the proprietary Fujitsu technology in a teardown.

     

    Fujitsu fast-cycle RAM found in Nintendo 3DS
    monday, march 28, 2011

    A teardown analysis conducted by UBM TechInsights of Nintendo Co. Ltd.'s 3DS handheld 3-D gaming device revealed that the device uses two Fujitsu Semiconductor Ltd. fast-cycle RAM (FCRAM) memories, the first time the proprietary Fujitsu technology has been found in a UBM TechInsights teardown, according to the firm.

     

    Updated: Samsung fabs Apple A5 processor
    saturday, march 12, 2011

    Samsung fabs the A5 processor used in the Apple iPad 2, according to teardowns of the system and chip conducted by UBM TechInsights, a division of United Business Media, publisher of EE Times.

     

    Inside the iPad2 and the Apple A5
    saturday, march 12, 2011

    Information on what's inside the Apple iPad2 is becoming available as teardown experts open up the first tablets going on sale. Here are some pictures and analysis from our sister division UBM TechInsights which is in the process of burrowing into the secrets of the system - including Apple's new A5 microprocessor.

     

    Photo gallery: Inside the Apple iPad 2
    Monday, march 12, 2011

    Welcome to what some call tech porn, a look inside the latest hot gadget. In this case it's the Apple iPad 2.

     
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